Article Side

Online Article Directory!

Hello Guest! Login or Register to submit articles!

Some Important Facts to Know About Wafer Dicing

By James Blee Subscribe to RSS | December 22nd 2011 | Views:

Individual chips on a silicon wafer also referred as ICs or integrated circuits are separated out by the process of wafer dicing. The process of dicing is fully automated with the use of a patented, proprietary technology that uses lasers. The important thing to get is efficiency, which translates into ultra thin wafers. The thickness of these wafers is less than 50 microns and this plays a big part in the semiconductor and electronics industry. There are machines which use advanced technologies and have revolutionized the whole process to a great extent. A variety of materials is diced, including ceramics, silicon, gallium arsenide, alumina and even semiconductors which are delicate compounds.

At the time of dicing, the wafers are held firmly on a sticky dicing tape, and once they are diced, we get what is referred to as a die. These will remain on the dicing tape from where they can be removed with the help of special equipment that handles dies. Another important thing to observe is the shape of the dies which you obtain. These could be rectangular, square or even in the form of straight lines with an average thickness of 35mm to about 0.5mm, although it must be noted that 35mm could prove to be a very large size.

There are several processes which are employed for dicing.. For example, you can do dicing through mechanical sawing as well as scribing and breaking. However, the most popular method is laser cutting. The wafer saws can give you a good shape, in the form of straight lines. Once the dies are obtained through dicing, they are then packaged. There are dry dicing and stealth dicing methods too which could be employed in very specific scenarios for very specific requirements such as some micro-electromechanical systems.

James Blee - About Author:
For more information on wafer dicing, check out the info available online; these will help you learn to find the wafer dicing!

Share on Facebook Tweet It Stumbleupon this post This post is delicious !

Article Source:

Related Technology Articles Subscribe to RSS

The Importance of Engine Parts for Earth Moving Equipment
Published by Matthew Stopford on August 26th 2012 | Technology
This article explains the importance of engine parts for earth moving equipment and expand on reputa...
Maintain a Perfect Heating and Cooling System in Seattle
Published by Amit on August 24th 2012 | Technology
Heating and cooling systems are imperative for any residence to live comfortably. However, proper ma...
Serve Your Clients Better by Hiring IT Consulting in Orlando
Published by Jack Martin on August 24th 2012 | Technology
IT consulting in Orlando is the newly adapted concept that every small and medium scale companies ha...
Microcontrollers and Electronics Circuits Making Electronics Magazine More Popular
Published by Shubhranshu Agarwal on August 24th 2012 | Technology
Access to online electronics portals is very easy; one needs to get himself registered with only few...
Microcontroller Based Electronics Designs to Make the Everyday Tasks Simplified
Published by Shubhranshu Agarwal on August 24th 2012 | Technology
Online Electronics For You magazines emerge as the best solution for the professionals who always wa...
Dot Net Development Platform for Business Applications
Published by Alex Franklin on August 23rd 2012 | Technology
The .Net platform was built from a scratch to overcome many of the problems that commonly accustomed...