The process of Silicon Wafer Dicing

Silicon Wafer Dicing is a process by which a separation is made between wafers and dies. This can be done by breaking with the use of a mechanical saw. Recently saws are being replaced with laser cutters for Silicon Wafer Dicing. The chips which come out after the dicing, is encapsulated for usage in computers and other electronic equipments. As dicing process is carried on, the mounted tape with sticky backing holds the dice coming out of wafer. After process of Silicon Wafer Dicing is completed, the dies are placed on printed circuit boards. The tape being sticky the dies derived from wafers remain stuck till the time it is physically extracted by die sorters. With Wafer Dicing Process, being completed dies available could be of various shapes and sizes but normally they are rectangular or square. The process of laser based technique is also called stealth dicing process.

As in silicon wafer dicing, the wafers have the highest value at the time of dicing. The idea has to be to increase in number of dies, yield per wafer. There is a system by which assorted semi conductor materials such as silicon and other compound material.

The gap between two dies adjacent to each other can be reduced by using the right saw which leaves the width of the narrow saw. This reduction of width helps in reduction of cost per die.

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The elimination of wear items and mechanical cutting device reduces further cost.

The automated dicing system can meet the exacting requirement which the mechanical system cannot perform. Silicon wafer dicing can be customized too. The highest quality dicing can be achieved by double cutting too. In some cases of lacer dicing thin wafers are perched on films.

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For more information on silicon wafer dicing, check out the info available online; these will help you learn to find the silicon dicing!

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