A Detailed View on Wafer Dicing

Author: reikopena | Posted: 15.02.2012

wafer dicing can be used in dicing materials such as gas, alumina, ceramics, gallium arsenide, silicon and silicon on sapphire. Wafer in scientific term is a thin slice of a semiconductor material which can be a silicon crystal. These wafers are used in many micro devices for the fabrication of the integrated circuits. The wafer dicing is the method where the wafer is processed first and then and then the die is separated from it. This can be done by breaking and scribing with a machine called dicing saw. It can also be done by laser cutting. When the dicing is over the silicon, chips are found and encapsulated to be used in electronic devices. These chips are often used in computer and all other electronic devices.

The alternative method of wafer dicing is the sleuth dicing. This is a laser based technique which is a two stage process where in the first stage the defect regions are identified by scanning the beam throughout the intended line of cutting and then they are introduced to the wafer. Then a carrier membrane is expanded under it to promote fracture. There are some wafer dicing companies which carry out this dicing and then sell the silicon diced chips in encapsulated form to the producers of different electronic equipments. The production volume and the length of the wafer that can be handled by the companies may differ a bit. The production process requires expertise and experiences both.

If you are responsible in gathering the diced silicon for the production of any electronic equipment for your company from one of them, it is important to understand the process and then check how much volume they can handle and how accurately they can do their job. you shall also try to know what the material that they can handle is.

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